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RM3100 Sensor breakout - M10073 hwrev

M10073 ISO

M10073 TOP

M10073 BOTTOM

The 3DR M10073 is a sensor-on-board assembly that was first designed for in-house designs, then released to the public. Designed to integrate PNI's RM3100 sensor suite at a board level, we bring this solderable module to lower complexity and bring down costs for your project.

More info about the sensor can be found here.

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3D View

Specifications

Specification Value
Dimensions 13 mm x 11.05 mm x 8.1 mm
Weight 0.82 g
Sensitivity 13nT
Noise 15nT
Linearity over ± 200 uT 0.50%
Field Measurement Range ± 1100 uT
Current @ 8Hz, 3 Axes 260 uA
Interface SPI and I2C
Operating Temperature -40°C to +85°C

For electrical specifications and function description please refer to the datasheet.

Downloads

Download 2D drawing PDF

Download STEP file